1 Introduction to Semiconductor Devices
John R. Hauser ............................................. 1-1
2 Overview of Interconnect—Copper and Low-K Integration
Girish A. Dixit and Robert H. Havemann ..................... 2-1
3 Silicon Materials
Wen Lin and Howard Huff .................................... 3-1
4 SOI Materials and Devices
Sorin Cristoloveanu and George K. Celler ................... 4-1
5 Surface Preparation
Glenn W. Gale, Brian K. Kirkpatrick, and Frederick
W. Kern, Jr. ............................................... 5-1
6 Supercritical Carbon Dioxide in Semiconductor Cleaning
Mohammed J. Meziani, Pankaj Pathak, and Ya-Ping Sun ........ 6-1
7 Ion Implantation
Michael Ameen, Ivan Berry, Walter Class, Hans-Joachim
Gossmann, and Leonard Rubin ................................ 7-1
8 Dopant Diffusion
Sanjay Banerjee ............................................ 8-1
9 Oxidation and Gate Dielectrics
C. Rinn Cleavelin, Luigi Colombo, Hiro Niimi, Sylvia Pas,
and Eric M. Vogel .......................................... 9-1
10 Silicides
Christian Lavoie, Francois M. d'Heurle and Shi-Li Zhang ... 10-1
11 Rapid Thermal Processing
P.J. Timans ............................................... 11-1
12 Low-K Dielectrics
Ting Y. Tsui and Andrew J. McKerrow ....................... 12-1
13 Chemical Vapor Deposition
Li-Qun Xia and Mei Chang .................................. 13-1
14 Atomic Layer Deposition
Thomas E. Seidel .......................................... 14-1
15 Physical Vapor Deposition
Stephen M. Rossnagel ...................................... 15-1
16 Damascene Copper Electroplating
Jonathan Reid ............................................. 16-1
17 Chemical-Mechanical Polishing
Gregory B. Shinn, Vincent Korthuis, Gautum Grover, Simon
Fang, and Duane S. Boning ................................. 17-1
18 Optical Lithography
Gene E. Fuller ............................................ 18-1
19 Photoresist Materials and Processing
César M. Garza, Will Conley, and Jeff Byers ............... 19-1
20 Photomask Fabrication
Syed A. Rizvi and Sylvia Pas .............................. 20-1
21 Plasma Etch
Peter L.G. Ventzek, Shahid Rauf, and Terry Sparks ......... 21-1
22 Equipment Reliability
Vallabh H. Dhudshia ....................................... 22-1
23 Overview of Process Control
Stephanie Watts Butler .................................... 23-1
24 In-Line Metrology
Alain C. Diebold .......................................... 24-1
25 In-Situ Metrology
Gabriel G. Barna and Brad VanEck .......................... 25-1
26 Yield Modeling
Ron Ross and Nick Atchison ................................ 26-1
27 Yield Management
Louis Breaux and Sean Collins ............................. 27-1
28 Electrical, Physical, and Chemical Characterization
Dieter K. Schroder, Bruno W. Schueler, Thomas Shaffner,
and Greg S. Strossman ..................................... 28-1
29 Failure Analysis
Lawrence C. Wagner ........................................ 29-1
30 Reliability Physics and Engineering
J.W. McPherson and E.T. Ogawa ............................. 30-1
31 Effects of Terrestrial Radiation on Integrated Circuits
Robert Baumann ............................................ 31-1
32 Integrated-Circuit Packaging
Michael Lamson, Andreas Cangellaris, and Erdogan Madenci .. 32-1
33 300 mm Wafer Fab Logistics and Automated Material
Handling Systems
Leonard Foster and Devadas Pillai ......................... 33-1
34 Factory Modeling
Samuel C. Wood ............................................ 34-1
35 Economics of Semiconductor Manufacturing
G. Dan Hutcheson .......................................... 35-1
Appendix A: Physical Constants ................................ A-1
Appendix B: Units Conversion .................................. В-1
Appendix C: Standards Commonly Used in Semiconductor
Manufacturing .............................................. С-1
Appendix D: Acronyms .......................................... D-1
Index ......................................................... I-l
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