Preface ....................................................... vii
Contributors ................................................... ix
1 Some Major Structural Dynamics-Related Failure Modes and
Mechanisms in Micro- and Opto-Electronic Systems and
Dynamic Stability of These Systems ........................... 1
David S. Steinberg
2 Linear Response to Shocks and Vibrations .................... 19
Ephraim Suhir
3 Linear and Nonlinear Vibrations Caused by Periodic
Impulses .................................................... 35
Ephraim Suhir
4 Random Vibrations of Structural Elements in Electronic and
Photonic Systems ............................................ 53
Ephraim Suhir
5 Natural Frequencies and Failure Mechanisms of Electronic
and Photonic Structures Subjected to Sinusoidal or Random
Vibrations .................................................. 75
David S. Steinberg
6 Dropflmpact of Typical Portable Electronic Devices:
Experimentation and Modeling ............................... 135
Т.X. Yu and C.Y. Zhou
7 Shock Test Methods and Test Standards for Portable
Electronic Devices ......................................... 159
C.Y. Zhou, Т.X. Yu, S.W. Ricky Lee, and Ephraim Suhir
8 Dynamic Response of Solder Joint Interconnections to
Vibration and Shock ........................................ 175
David S. Steinberg
9 Test Equipment, Test Methods, Test Fixtures, and Test
Sensors for Evaluating Electronic Equipment ................ 183
David S. Steinberg
10 Correlation between Package-Level High-Speed Solder Ball
Shear/Pull and Board-Level Mechanical Drop Tests with
Brittle Fracture Failure Mode, Strength, and Energy ........ 195
Fubin Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and
Stephen Clark
11 Dynamic Mechanical Properties and Microstructural Studies
of Lead-Free Solders in Electronic Packaging ............... 255
V.В.C. Tan, К.C. Ong, С.T. Lim, and J.E. Field
12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration ..................................... 277
Т.E. Wong
13 Vibration Considerations for Sensitive Research and
Production Facilities ...................................... 309
E.E. Ungar, H. Amick, and J.A. Zapfe
14 Applications of Finite Element Analysis: Attributes and
Challenges ................................................. 327
Metin Ozen
15 Shock Simulation of Drop Test of Hard Disk Drives .......... 337
D.W. Shu, B.J. Shi, and J. Luo
16 Shock Protection of Portable Electronic Devices Using
a "Cushion" of an Array of Wires (AOW) ..................... 357
Ephraim Suhir
17 Board-Level Reliability of Lead-Free Solder under
Mechanical Shock and Vibration Loads ....................... 371
Toni Т. Matilla, Pekka Marjamaki, and Jorma Kivilahti
18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests .......................................... 415
Milena Vujosevic and Ephraim Suhir
19 Linear Response of Single-Degree-of-Freedom System to
Impact Load: Could Shock Tests Adequately Mimic Drop Test
Conditions? ................................................ 435
Ephraim Suhir
20 Shock Isolation of Micromachined Device for High-g
Applications ............................................... 449
Sang-Hee Yoon, Jin-Eep Roh, and Ki Lyug Kim
21 Reliability Assessment of Microelectronics Packages Using
Dynamic Testing Methods .................................... 485
X.Q. Shi, G.Y. Li, and Q.J. Yang
22 Thermal Cycle and Vibration/Drop Reliability of Area
Array Package Assemblies ................................... 519
Reza Ghaffarian
23 Could an Impact Load of Finite Duration Be Substituted
with an Instantaneous Impulse? ............................. 575
Ephraim Suhir and Luciano Arruda
Index ......................................................... 589
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