Roth J.R. Industrial plasma engineering. Vol.2. Applications to nonthermal plasma processing
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Roth J.R. Industrial plasma engineering. Vol.2. Applications to nonthermal plasma processing / Roth J.R. - Bristol; Philadelphia: Institute of Physics, 2001. - 645 p. - ISBN 0-7503-0545-2.
 
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Contents, Volume 1: Principles ................................... viii

Preface to Volume 2 ................................................ ix

14 Surface Interactions in Plasma Processing ........................ 1
   14.1 Industrial Plasma Processing ................................ 1
   14.2 Plasma Active Species ....................................... 6
   14.3 Heterogeneous Interactions with Surfaces .................... 9
   14.4 Secondary Electron Emission ................................ 15
   14.5 Sputtering ................................................. 17
   14.6 Ion Implantation in Solids ................................. 31
        References ................................................. 35

15 Atmospheric Pressure Plasma Sources ............................. 37
   15.1 Characteristics of Industrial Plasma Sources ............... 38
   15.2 Atmospheric Pressure Corona Sources ........................ 46
   15.3 Atmospheric Dielectric Barrier Discharges (DBDs) ........... 50
   15.4 The One Atmosphere Uniform Glow Discharge Plasma
        (OAUGDP) ................................................... 55
   15.5 Arcjet Plasma Sources ...................................... 65
   15.6 Inductively Coupled Plasma Torches ......................... 69
        References ................................................. 72

16 Vacuum Plasma Sources ........................................... 74
   16.1 Intermediate-Pressure Plasma Sources ....................... 74
   16.2 Low-Pressure Plasma Sources ................................ 93
   16.3 High-Vacuum Plasma Sources ................................ 108
   16.4 Summary of Plasma Source Parameters ....................... 109
        References ................................................ 110

17 Plasma Reactors for Plasma Processing .......................... 113
   17.1 Plasma Reactors for Surface Treatment ..................... 115
   17.2 Plasma Reactors for Ion Implantation ...................... 139
   17.3 Reactors for Ion-Beam-Induced Sputter Deposition .......... 146
   17.4 Plasma/Cathode Sputter Deposition Reactors ................ 157
   17.5 Reactors for Plasma Chemical Vapor Deposition ............. 167
   17.6 Plasma Etching Reactors ................................... 179
        References ................................................ 193

18 Specialized Techniques and Devices for Plasma Processing ....... 196
   18.1 Vacuum System Operation ................................... 196
   18.2 Workpiece Current Collection .............................. 200
   18.3 Remote Exposure Configurations ............................ 205
   18.4 Motional Averaging to Achieve Uniformity of Effect ........ 211
   18.5 Gas Flow Distribution ..................................... 219
   18.6 Electrohydrodynamic (EHD) Flow Control .................... 225
        References ................................................ 239

19 Parametric Plasma Effects On Plasma Processing ................. 240
   19.1 The Role of the Plasma .................................... 240
   19.2 Kinetic Parameters of Plasma Processing ................... 243
   19.3 RF Power Coupling ......................................... 249
   19.4 Sheath Thickness Above Workpiece .......................... 255
   19.5 RF Sheath Phenomenology ................................... 263
   19.6 Formation of Active Species ............................... 271
   19.7 The Effect of Electron Magnetization on Active-Species
        Concentration ............................................. 277
        References ................................................ 283

20 Diagnostics for Plasma Processing .............................. 284
   20.1 Experimental Parameters ................................... 284
   20.2 Gas-Phase Process Monitoring .............................. 286
   20.3 Plasma Diagnostics ........................................ 295
   20.4 Measurement of Surface Topography ......................... 313
   20.5 Measurement of Surface Composition ........................ 315
   20.6 Surface Energy Related Diagnostics ........................ 318
   20.7 Measurement of Electrical Properties ...................... 325
   20.8 In Situ Process Monitoring ................................ 328
   20.9 Endpoint Detection ........................................ 332
        References ................................................ 333

21 Plasma Treatment of Surfaces ................................... 335
   21.1 Objectives of Plasma Surface Treatment .................... 335
   21.2 Passive Plasma Cleaning ................................... 341
   21.3 Active Plasma Cleaning .................................... 352
   21.4 Plasma Sterilization ...................................... 360
   21.5 Treatment of Thin Films ................................... 369
   21.6 Treatment of Polymeric or Organic Solids .................. 376
   21.7 Treatment of Fabrics and Fibers ........................... 383
        References ................................................ 396

22 Surface Modification by Implantation and Diffusion ............. 399
   22.1 Ion Implantation Technology ............................... 399
   22.2 Ion Implantation Dose and Depth Profiles .................. 403
   22.3 Ion-Beam Implantation ..................................... 411
   22.4 Plasma Ion Implantation ................................... 421
   22.5 Low-Energy Plasma Thermal Diffusion Treatment ............. 443
        References ................................................ 448

23 Thin-Film Deposition by Evaporative Condensation
   and Sputtering ................................................. 451
   23.1 Applications of Thin Films ................................ 451
   23.2 Thin-Film Characteristics ................................. 461
   23.3 Deposition by Evaporative Condensation .................... 471
   23.4 Ion-Beam Sputter Deposition ............................... 477
   23.5 Plasma-Assisted Ion-Beam Sputter Deposition ............... 490
   23.6 Plasma/Cathode Sputter Deposition ......................... 495
   23.7 Quality Issues in Sputter Deposition ...................... 499
        References ................................................ 500

24 Plasma Chemical Vapor Deposition (PCVD) ........................ 502
   24.1 Thin-Film Deposition by PCVD .............................. 502
   24.2 Physical and Chemical Processes in PCVD Glow Discharges ... 510
   24.3 Characteristics of Polymeric Thin Films Formed by PCVD .... 517
   24.4 Glow Discharge Polymerization ............................. 528
   24.5 Glow Discharge Reactors for PCVD .......................... 531
   24.6 Summary of Deposition Reactor Plasma Parameters ........... 537
        References ................................................ 538

25 Plasma Etching ................................................. 540
   25.1 Survey of Plasma Etching .................................. 540
   25.2 Pattern Transfer by Plasma-Related Etching ................ 551
   25.3 Control Variables for Plasma Etching ...................... 573
   25.4 The Chemistry of Plasma Etching ........................... 578
   25.5 Plasma Etching of Microelectronic Materials ............... 597
   25.6 Technical Issues in Plasma Etching ........................ 605
        References ................................................ 612

Appendices ........................................................ 614

A Nomenclature .................................................... 614

B Physical Constants .............................................. 623

C Units and Conversion Factors .................................... 624

D Useful Formulae ................................................. 626

Index ............................................................. 628


Вверх Roth J.R. Industrial plasma engineering. Vol.2. Applications to nonthermal plasma processing / Roth J.R. - Bristol; Philadelphia: Institute of Physics, 2001. - 645 p. - ISBN 0-7503-0545-2.

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