Handbook of semiconductor manufacturing technology (Boca Raton, 2008). - ОГЛАВЛЕНИЕ / CONTENTS

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ОбложкаHandbook of semiconductor manufacturing technology / ed. by R.Doering, Y.Nishi. - 2nd ed. - Boca Raton [et al.]: CRC press: Taylor & Francis, 2008. - 1 vol. (var. pag.): Ill. ; 25 cm. - Bibliogr. at the end of the chapters. - Ind. at the end of the book. - ISBN 1-57444-675-4; ISBN 978-1-57444-675-3
 

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Оглавление / Contents
 
1  Introduction to Semiconductor Devices 
   John R. Hauser ............................................. 1-1
2  Overview of Interconnect—Copper and Low-K Integration 
   Girish A. Dixit and Robert H. Havemann ..................... 2-1
3  Silicon Materials
   Wen Lin and Howard Huff .................................... 3-1
4  SOI Materials and Devices
   Sorin Cristoloveanu and George K. Celler ................... 4-1
5  Surface Preparation
   Glenn W. Gale, Brian K. Kirkpatrick, and Frederick
   W. Kern, Jr. ............................................... 5-1
6  Supercritical Carbon Dioxide in Semiconductor Cleaning
   Mohammed J. Meziani, Pankaj Pathak, and Ya-Ping Sun ........ 6-1
7  Ion Implantation
   Michael Ameen, Ivan Berry, Walter Class, Hans-Joachim
   Gossmann, and Leonard Rubin ................................ 7-1
8  Dopant Diffusion
   Sanjay Banerjee ............................................ 8-1
9  Oxidation and Gate Dielectrics
   C. Rinn Cleavelin, Luigi Colombo, Hiro Niimi, Sylvia Pas,
   and Eric M. Vogel .......................................... 9-1
10 Silicides
   Christian Lavoie, Francois M. d'Heurle and Shi-Li Zhang ... 10-1
11 Rapid Thermal Processing
   P.J. Timans ............................................... 11-1
12 Low-K Dielectrics
   Ting Y. Tsui and Andrew J. McKerrow ....................... 12-1
13 Chemical Vapor Deposition
   Li-Qun Xia and Mei Chang .................................. 13-1
14 Atomic Layer Deposition
   Thomas E. Seidel .......................................... 14-1
15 Physical Vapor Deposition
   Stephen M. Rossnagel ...................................... 15-1
16 Damascene Copper Electroplating
   Jonathan Reid ............................................. 16-1
17 Chemical-Mechanical Polishing
   Gregory B. Shinn, Vincent Korthuis, Gautum Grover, Simon 
   Fang, and Duane S. Boning ................................. 17-1
18 Optical Lithography
   Gene E. Fuller ............................................ 18-1
19 Photoresist Materials and Processing
   César M. Garza, Will Conley, and Jeff Byers ............... 19-1
20 Photomask Fabrication
   Syed A. Rizvi and Sylvia Pas .............................. 20-1
21 Plasma Etch
   Peter L.G. Ventzek, Shahid Rauf, and Terry Sparks ......... 21-1
22 Equipment Reliability
   Vallabh H. Dhudshia ....................................... 22-1
23 Overview of Process Control
   Stephanie Watts Butler .................................... 23-1
24 In-Line Metrology
   Alain C. Diebold .......................................... 24-1
25 In-Situ Metrology
   Gabriel G. Barna and Brad VanEck .......................... 25-1
26 Yield Modeling
   Ron Ross and Nick Atchison ................................ 26-1
27 Yield Management
   Louis Breaux and Sean Collins ............................. 27-1
28 Electrical, Physical, and Chemical Characterization
   Dieter K. Schroder, Bruno W. Schueler, Thomas Shaffner,
   and Greg S. Strossman ..................................... 28-1
29 Failure Analysis
   Lawrence C. Wagner ........................................ 29-1
30 Reliability Physics and Engineering
   J.W. McPherson and E.T. Ogawa ............................. 30-1
31 Effects of Terrestrial Radiation on Integrated Circuits
   Robert Baumann ............................................ 31-1
32 Integrated-Circuit Packaging
   Michael Lamson, Andreas Cangellaris, and Erdogan Madenci .. 32-1
33 300 mm Wafer Fab Logistics and Automated Material
   Handling Systems
   Leonard Foster and Devadas Pillai ......................... 33-1
34 Factory Modeling
   Samuel C. Wood ............................................ 34-1
35 Economics of Semiconductor Manufacturing
   G. Dan Hutcheson .......................................... 35-1

Appendix A: Physical Constants ................................ A-1
Appendix B: Units Conversion .................................. В-1
Appendix C: Standards Commonly Used in Semiconductor 
   Manufacturing .............................................. С-1
Appendix D: Acronyms .......................................... D-1

Index ......................................................... I-l


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